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Resin Sealant Glue AB Glue Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting Casting Encapsulation
$ 3.86
-
$ 4.99
/ Kilogram
FOB Price
MOQ : 20 kilograms
Product Details
Materials:
Epoxy resin and curing agent.
Usage:
Used for potting, sealing, casting and encapsulating suitable electronic and electrical components to provide protection from environmental exposure.
Origin:
Guangdong, China
Price:
$ 3.86 / Kilogram
Storage:
Store in a cool, dry and well-ventilated place away from direct sunlight, heat and moisture. Keep containers tightly sealed when not in use.
Content:
Electronic components, circuit boards, LED components, electrical equipment, electronic potting, casting and encapsulation.
Packaging:
Supplied in sealed containers, tubes or suitable AB packaging with protective outer packaging to prevent leakage and damage during transportation.
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| Material | Epoxy resin and curing agent. |
|---|---|
| Place of Origin | Guangdong, China |
| Application | Electronic components, circuit boards, LED components, electrical equipment, electronic potting, casting and encapsulation. |
| Usage | Used for potting, sealing, casting and encapsulating suitable electronic and electrical components to provide protection from environmental exposure. |
| Product Specification | Two-component AB epoxy potting compound, resin adhesive and sealant formulation designed for electronic potting, casting and encapsulation applications. |
| Packaging | Supplied in sealed containers, tubes or suitable AB packaging with protective outer packaging to prevent leakage and damage during transportation. |
| Product Storage Type | Store in a cool, dry and well-ventilated place away from direct sunlight, heat and moisture. Keep containers tightly sealed when not in use. |
|---|---|
| Product Grade | Electronic & Industrial Grade |
| Transport Package | Supplied in sealed containers, tubes or suitable AB packaging with protective outer packaging to prevent leakage and damage during transportation. |
| Origin | Guangdong, China |
Additional Product Specifications
| Specification Title | Specification Details |
|---|---|
| AB Two Component Epoxy Potting Compound Resin Adhesive for Electronic Casting Encapsulation and Sealing | This AB epoxy potting compound combines epoxy resin and curing components for electronic potting, casting and encapsulation applications. It is suitable for sealing and protecting compatible electronic and electrical components, including circuit boards and LED-related components. |
Business Type:
Custom Manufacturer
Main Products:
Year of Establishment:
0
Plant Area:
Average Lead Time:
SGS Serial NO.:
Average Response Time:
≤15h
International Commercial Terms(Incoterms):
EXW, FOB, CIF, DAP, DDP
Terms of Payment:
LC, T/T, PayPal, Western Union
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